Bonding structure with buffer layer and method of forming...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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C257S786000, C361S803000

Reexamination Certificate

active

07446421

ABSTRACT:
A bonding structure with a buffer layer, and a method of forming the same are provided. The bonding structure comprises a first substrate with metal pads thereon, a protection layer covered on the surface of the substrate, a first adhesive metal layer formed on the metal pads, a buffer layer coated on the protection layer and the metal pads, a first metal layer covered on the buffer layer, and a second substrate with electrodes and a bonding layer thereon. The first metal layer, the electrodes and the bonding layer are bonded to form the bonding structure. Direct bonding can be performed through surface activation or heat pressure. The method uses fewer steps and is more reliable. The temperature required for bonding the structure is lower. The bonding density between the contacted surfaces is increased to a fine pitch. The quality at the bonding points is increased because fewer contaminations between the contacted surfaces are generated.

REFERENCES:
patent: 5393697 (1995-02-01), Chang et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 6042682 (2000-03-01), Funaya et al.
patent: 6084301 (2000-07-01), Chang et al.
patent: 6249051 (2001-06-01), Chang et al.
patent: 6537854 (2003-03-01), Chang et al.
patent: 6767818 (2004-07-01), Chang et al.
patent: 6972490 (2005-12-01), Chang et al.
patent: 7183494 (2007-02-01), Lu et al.
patent: 7239027 (2007-07-01), Lu
patent: 7348271 (2008-03-01), Huang et al.

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