4. Adhesive bonding and miscellaneous chemical manufacture
  5. Surface bonding means and/or assembly means therefor
  6. Automatic and/or material-triggered control

Shinkawa Ltd.

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Bonding apparatus and bonding method

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Bonding apparatus and bonding method

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Bonding apparatus and wire bonding method

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Inner lead bonder

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent

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Semiconductor device and wire bonding method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-601247

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