Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2011-07-12
2011-07-12
Stoner, Kiley (Department: 1735)
Metal fusion bonding
Process
Plural joints
C228S004500, C228S201000, C134S001200
Reexamination Certificate
active
07975901
ABSTRACT:
A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.
REFERENCES:
patent: 5433371 (1995-07-01), Morisako
patent: 6320155 (2001-11-01), Barnett
patent: 7795557 (2010-09-01), Brunner et al.
patent: 2007/0000878 (2007-01-01), Fujita et al.
patent: 2007/0001320 (2007-01-01), Maeda
patent: 2008/0023028 (2008-01-01), Fujita
patent: 2008/0023525 (2008-01-01), Maeda et al.
patent: 63-55946 (1988-03-01), None
patent: 02-112246 (1990-04-01), None
patent: 04-196333 (1992-07-01), None
patent: 06-132343 (1994-05-01), None
patent: 2001-68500 (2001-03-01), None
patent: 2006-332151 (2006-12-01), None
patent: 2006-332152 (2006-12-01), None
patent: 2007-12909 (2007-01-01), None
patent: 2007-12910 (2007-01-01), None
Maeda Toru
Teramoto Akinobu
Utano Tetsuya
Katten Muchin & Rosenman LLP
Shinkawa Ltd.
Stoner Kiley
Tohoku University
LandOfFree
Bonding apparatus and wire bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding apparatus and wire bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding apparatus and wire bonding method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2674174