Bonding apparatus and bonding method

Metal fusion bonding – Process – Plural joints

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S041000, C228S248100

Reexamination Certificate

active

07743964

ABSTRACT:
A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that carries out secondary bonding so that the electrodes become conductive by pressurizing the primary bonded bump in bonding direction and by heating the bump to pressurize and sinter the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.

REFERENCES:
patent: 5547530 (1996-08-01), Nakamura et al.
patent: 5597110 (1997-01-01), Melton et al.
patent: 6015083 (2000-01-01), Hayes et al.
patent: 7264991 (2007-09-01), Lin
patent: 7371674 (2008-05-01), Suh et al.
patent: 7393771 (2008-07-01), Hozoji et al.
patent: 7600667 (2009-10-01), Hwang
patent: 2003/0222343 (2003-12-01), Sakaida
patent: 2004/0245648 (2004-12-01), Nagasawa et al.
patent: 2005/0110161 (2005-05-01), Naito et al.
patent: 2006/0160330 (2006-07-01), Kobayashi et al.
patent: 2007/0080758 (2007-04-01), Nagano
patent: 2007/0216012 (2007-09-01), Hozoji et al.
patent: 09326416 (1997-12-01), None
patent: 10150075 (1998-06-01), None
patent: 2004327908 (2004-11-01), None
patent: 2004342716 (2004-12-01), None
patent: 2005203468 (2005-07-01), None
patent: 2006054212 (2006-02-01), None
patent: 2006202938 (2006-08-01), None
patent: 2007208082 (2007-08-01), None
International Search Report dated May 1, 2008 from corresponding PCT/JP2008/053327.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonding apparatus and bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding apparatus and bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding apparatus and bonding method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4212943

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.