Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2008-02-26
2010-06-29
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
Plural joints
C228S041000, C228S248100
Reexamination Certificate
active
07743964
ABSTRACT:
A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that carries out secondary bonding so that the electrodes become conductive by pressurizing the primary bonded bump in bonding direction and by heating the bump to pressurize and sinter the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.
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Katten Muchin & Rosenman LLP
Shinkawa Ltd.
Stoner Kiley
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