Inner lead bonder

Details Inner lead bonder Inner lead bonder

1983-12-05

1985-07-02

Kimlin, Edward

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156363, 156542, 156567, 156230, 29740, 414541, 198408, 269 57, B65G 2500, B32B 3100, B23P 1900, B44C 100

Patent

active

045266468

ABSTRACT:
An inner lead bonder for bonding dies to leads of carrier tape with improved positional accuracy and improved work efficiency. In the inner lead bonder, dies are fed to a die positioning spot one at a time and positioned. Then, said positioned die is carried to a bonding position. On the other hand, leads of a carrier tape are fed to the bonding position and positioned at the spot above the aforesaid die. Thereafter, the leads of the carrier tape are pressed onto the die and bonded by using a bonding tool. This inner lead bonder is characterized in that it includes a rotary table with the size covering the die positioning point and the bonding position, and after positioning the die on the rotary table, the rotary table is rotated in order to bring the die positioned as mentioned above to the bonding position to place the die at a proper position for bonding.

REFERENCES:
patent: 3743558 (1973-07-01), Ludwig
patent: 3894633 (1975-07-01), Egan et al.
patent: 4036484 (1977-07-01), Schneeman
patent: 4116376 (1978-09-01), Delorme et al.
patent: 4239576 (1980-12-01), Taki et al.
patent: 4292108 (1981-09-01), Weiss et al.
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4373840 (1983-02-01), Miller, Jr.
patent: 4459743 (1984-07-01), Watanabe et al.

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