4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Shin Nakao

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Dimensionally stable semiconductor device

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent

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Method of making a dimensionally stable semiconductor device

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Resin seal semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Resin seal semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Resin seal semiconductor package and manufacturing method of the

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Profile ID: LFUS-PAI-P-311658

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