Dimensionally stable semiconductor device

Details Dimensionally stable semiconductor device Dimensionally stable semiconductor device

1983-09-22

1985-12-24

Davie, James W.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 361386, 174 16HS, H01L 2710, H01L 2310

Patent

active

045610118

ABSTRACT:
A heat dissipating member including a heat sink is placed on a module base board with flip-chips mounted thereon, with metallic plates and first adhesive materials of a good thermal conductivity interposed between the heat dissipating member and the flip-chips in a close contact relation and with a second adhesive material interposed between the heat dissipating member and the base board, wherein the first adhesive material is selected to have a melting point lower than that of the second adhesive material, and then such an assembly is heated so that both the first and second adhesive materials are melted and the metallic plates are mounted onto the flip-chips and the heat dissipating member is mounted onto the base board. A gap is formed between the metallic plates and the heat dissipating member as a result of earlier solidification of the second adhesive material than that of the first adhesive material so as to be precisely controlled such that a heat transferring effect therebetween may not be degraded.

REFERENCES:
patent: 4034468 (1977-07-01), Koopman
patent: 4034469 (1977-07-01), Koopman
patent: 4233645 (1980-11-01), Balderes et al.
Gupta, O. R., Inner Fin Air Cooled Module, IBM Technical Disclosure Bulletin, vol. 19, No. 5, (10/76).
Koopman et al., Solid State Expanding Alloys for Chip Thermal Connection, IBM Tech. Disc. Bull., vol. 19, No. 9, (2/1977).
Hultmark et al., Dimensional Control for Semiconductor Package, IBM Technical Disclosure Bulletin, vol. 21, No. 7, (12/78).
Arnold et al., Module with Internal Elements for Reducing Thermal Resistance, IBM Tech. Disc. Bull., vol. 21, No. 4, (9/1978).
Doo et al., Controlled Gap in Semiconductor Packages, IBM Technical Disclosure Bulletin, vol. 20, No. 4, (9/77).
Lynch, J. R., Air and Liquid Drop Cooled Module, IBM Tech. Disc. Bull., vol. 22, No. 1, (6/1978).

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