Resin seal semiconductor package and manufacturing method of the

Details Resin seal semiconductor package and manufacturing method of the Resin seal semiconductor package and manufacturing method of the

1997-04-14

1999-07-06

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438118, 438119, 438121, 438124, H01L 2144, H01L 2148, H01L 2150

Patent

active

059207701

ABSTRACT:
Bonding pads are formed on a main surface of a semiconductor chip. An insulating layer having openings located on the bonding pads is formed on the main surface of the semiconductor chip. Base metal layers are formed on the bonding pads. A buffer coat film having a portion laid on a periphery of the base metal layer is formed on the insulating layer. Connection layers are formed on the base metal layers. First conductors are formed on the connection layers. A seal resin exposing only top surfaces of the first conductors is formed. Lumpish second conductors are formed on the top surfaces of the first conductor. Thereby, a resin seal semiconductor package can be made compact and it has improved electrical characteristics and high reliability.

REFERENCES:
patent: 4472730 (1984-09-01), Ohta
patent: 5093281 (1992-03-01), Esutmo
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5139969 (1992-08-01), Mori
patent: 5171716 (1992-12-01), Cagan et al.
patent: 5205036 (1993-04-01), Yamazaki
patent: 5244838 (1993-09-01), Casati et al.
patent: 5304512 (1994-04-01), Arai et al.
patent: 5321303 (1994-06-01), Kawahata et al.
patent: 5327013 (1994-07-01), Moore et al.
patent: 5331235 (1994-07-01), Chun
patent: 5371044 (1994-12-01), Yoshido et al.
patent: 5373190 (1994-12-01), Ichiyama
patent: 5427938 (1995-06-01), Matsumura et al.
patent: 5438478 (1995-08-01), Kondo et al.
patent: 5474958 (1995-12-01), Djennas et al.

Affiliated with

Also associated with

Rating

Resin seal semiconductor package and manufacturing method of the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin seal semiconductor package and manufacturing method of the, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin seal semiconductor package and manufacturing method of the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-906925