Method of making a dimensionally stable semiconductor device

Details Method of making a dimensionally stable semiconductor device Method of making a dimensionally stable semiconductor device

1985-10-03

1987-04-07

Rosenbaum, Mark

Metal working

Method of mechanical manufacture

Electrical device making

H05K 334

Patent

active

046549668

ABSTRACT:
A heat dissipating member including a heat sink is placed on a module base board with flip-chips mounted thereon, with metallic plates and first adhesive materials of a good thermal conductivity interposed between the heat dissipating member and the flip-chips in a close contact relation and with a second adhesive material interposed between the heat dissipating member and the base board, wherein the first adhesive material is selected to have a melting point lower than that of the second adhesive material, and then such an assembly is heated so that both the first and second adhesive materials are melted and the metallic plates are mounted onto the flip-chips and the heat dissipating member is mounted onto the base board. A gap is formed between the metallic plates and the heat dissipating member as a result of earlier solidification of the second adhesive material than that of the first adhesive material so as to be precisely controlled such that a heat transferring effect therebetween may not be degraded.

REFERENCES:
patent: 4069498 (1978-01-01), Joshi
patent: 4092697 (1978-05-01), Spaight
IBM Technical Discl. Bulletin, vol. 20, No. 7, Dec. 1977 by H. Krumm.
IBM Technical Discl. Bulletin, vol. 22, No. 2, Jul. 1979 by B. T. Clark et al.
IBM Technical Discl. Bulletin, vol. 22, No. 6, Nov. 1979 by A. J. Arnold.

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