4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With semiconductor element forming part

Shih-Ping Hsu

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active

Attachment of a stiff heat spreader for fabricating a cavity...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Carrying structure of electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Circuit barrier structure of semiconductor packaging...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Circuit board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Circuit board structure

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Profile ID: LFUS-PAI-P-2250959

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