Circuit barrier structure of semiconductor packaging...

Details Circuit barrier structure of semiconductor packaging... Circuit barrier structure of semiconductor packaging...

2006-03-14

2006-03-14

Loke, Steve (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S627000, C438S652000, C438S653000, C257S748000, C257S774000

Reexamination Certificate

active

07012019

ABSTRACT:
A circuit barrier structure of a semiconductor packaging substrate and a method for fabricating the same, forming a metal conductive layer on an insulating layer of the substrate and a patterned resist layer on the metal conductive layer. The patterned resist layer has a plurality of holes to expose predetermined parts of the metal conductive layer. A metal barrier layer is formed on the resist layer and in the holes. A patterned circuit layer is electroplated in the holes of the resist layer after removing the metal barrier layer on the resist layer. The resist layer and the metal conductive layer underneath the resist layer are removed. Another metal barrier layer can be formed on the circuit layer. The patterned circuit layer is covered by the metal barrier layers to prevent damage from etching to the circuit layer and inhibit migration of metal particles in the circuit layer.

REFERENCES:
patent: 5275715 (1994-01-01), Tuttle
patent: 5436198 (1995-07-01), Shibata
patent: 5633189 (1997-05-01), Yen et al.
patent: 5645628 (1997-07-01), Endo et al.
patent: 628998 (1994-05-01), None

Affiliated with

Also associated with

Rating

Circuit barrier structure of semiconductor packaging... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit barrier structure of semiconductor packaging..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit barrier structure of semiconductor packaging... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3580346