Carrying structure of electronic components

Details Carrying structure of electronic components Carrying structure of electronic components

2007-10-02

2007-10-02

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000, C257S698000, C257SE21511, C438S613000, C438S108000

Reexamination Certificate

active

11237314

ABSTRACT:
A carrying structure of electronic components is proposed. The carrying structure includes at least one supporting board with at least one cavity disposed thereon, at least one adhesive layer formed on the supporting board, and at least one electronic component having an active face and a non-active face located in the cavity. The gap between the cavity and the electronic component is filled with a portion of the adhesive layer, and thus the electronic component is fixed in the cavity of the supporting board.

REFERENCES:
patent: 5293069 (1994-03-01), Kato et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 6696764 (2004-02-01), Honda
patent: 6919508 (2005-07-01), Forcier
patent: 2004/0007771 (2004-01-01), Shin et al.
patent: 2004/0036158 (2004-02-01), Tanaka et al.
patent: 2004/0183187 (2004-09-01), Yamasaki et al.

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