Circuit board structure

Details Circuit board structure Circuit board structure

2007-10-04

2010-12-28

Patel, Ishwarbhai B (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07858885

ABSTRACT:
The present invention provides a circuit board structure, the circuit board structure consisting of a carrier board having a first surface and an opposed second surface, the carrier board being formed with at least one through hole penetrating the first and second surfaces; a conductive pillar formed in the through hole by electroplating; and a first circuit layer and a second circuit layer respectively formed on the first and second surfaces of the carrier board, the first and second circuit layers being electrically connected to the two end portions of the conductive pillar, thereby reducing spacing between adjacent conductive pillars of the carrier board and achieving high density circuit layout.

REFERENCES:
patent: 4770900 (1988-09-01), Seibel
patent: 5537740 (1996-07-01), Shirai et al.
patent: 6303881 (2001-10-01), Parker et al.
patent: 6418616 (2002-07-01), Bhatt et al.
patent: 6512186 (2003-01-01), Nishiwaki et al.
patent: 2006/0029726 (2006-02-01), Mok et al.
patent: 410051094 (1998-02-01), None

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