4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Shih-Hsun Hsu

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Bond pad structures and integrated circuit chip having the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Chemical mechanical polishing equipment

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
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Method and apparatus for enhanced CMP planarization using...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Method for planarization of wafers with high selectivities

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
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Profile ID: LFUS-PAI-P-2664007

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