Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-10-11
2011-12-06
Nguyen, Ha Tran T (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S048000, C257S773000, C257S781000, C257S784000, C257SE21522, C257SE21523, C257SE23151, C438S014000, C438S015000
Reexamination Certificate
active
08072076
ABSTRACT:
Bonding pad structures and integrated circuits having the same are provided. An exemplary embodiment of a bond pad structure comprises a bond pad layer. A passivation layer partially covers the bond pad layer from edges thereof and exposes a bonding surface, wherein the passivation layer is formed with a recess on at least one edge of the bonding surface to thereby define a probe needle contact area for probe needle testing and a wire bonding area for wire bonding on the bonding surface, and the probe needle contact area and the wire bonding area have a non-overlapping relationship.
REFERENCES:
patent: 6765228 (2004-07-01), Lin et al.
patent: 6844631 (2005-01-01), Yong et al.
patent: 7329951 (2008-02-01), Daubenspeck et al.
patent: 2005/0098903 (2005-05-01), Yong et al.
patent: 2006/0065969 (2006-03-01), Antol et al.
patent: 2007/0045865 (2007-03-01), Tang et al.
Chen Hsien-Wei
Hou Shang-Yun
Hsu Shih-Hsun
Jeng Shih-Puu
Birch & Stewart Kolasch & Birch, LLP
Gupta Raj R
Nguyen Ha Tran T
Taiwan Semiconductor Manufacturing Co. Ltd.
LandOfFree
Bond pad structures and integrated circuit chip having the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bond pad structures and integrated circuit chip having the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bond pad structures and integrated circuit chip having the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4309509