4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Shih Chang Lee

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Method of making leadless semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Semiconductor chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Semiconductor chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With means to prevent explosion of package
Reexamination Certificate

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Semiconductor chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Substrate strip for use in packaging semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2035132

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