Semiconductor chip package

Details Semiconductor chip package Semiconductor chip package

2006-12-18

2009-10-20

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C257SE23003, C257SE21499, C257SE33056

Reexamination Certificate

active

07605020

ABSTRACT:
A method of manufacturing a semiconductor chip package includes mechanically and electrically connecting a semiconductor chip to a top surface of a main substrate, securely attaching the semiconductor chip to a recessed cavity on a bottom surface of an interconnection substrate, mechanically and electrically connecting the main substrate to the interconnection substrate, and cutting the main substrate to form a central substrate and a peripheral substrate wherein the semiconductor chip is disposed on the central substrate. The cutting step is conducted either (i) by forming a plurality of slots such that the central substrate and the peripheral substrate are partially conned to each other or (ii) by completely separating the central substrate and the peripheral substrate.

REFERENCES:
patent: 6603191 (2003-08-01), Wakabayashi et al.
patent: 6649448 (2003-11-01), Tomihara
patent: 6710457 (2004-03-01), Silverbrook
patent: 6720647 (2004-04-01), Fukuizumi
patent: 6921683 (2005-07-01), Nakayama
patent: 2001/0042902 (2001-11-01), Wakabayashi et al.
patent: 2002/0041025 (2002-04-01), Tomihara
patent: 2002/0094606 (2002-07-01), Fukutomi et al.
patent: 2002/0168798 (2002-11-01), Glenn et al.
patent: 2002/0185747 (2002-12-01), Hashimoto
patent: 2003/0052419 (2003-03-01), Ujiie et al.
patent: 2003/0071353 (2003-04-01), Noguchi
patent: 2003/0146508 (2003-08-01), Chen et al.
patent: 2003/0162324 (2003-08-01), Tomimatsu
patent: 2005/0078434 (2005-04-01), Ho
patent: 2000100866 (2000-04-01), None

Affiliated with

Also associated with

Rating

Semiconductor chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4061327