Shigeki Sako

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Hybrid resin-sealed semiconductor device

Patent

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Plastic molded type semiconductor device

Electricity: conductors and insulators – Feedthrough or bushing – Compression
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Plastic packaged device having a hollow portion enclosing a chip

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Plastic-molded type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Portion of semiconductor device

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
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Profile ID: LFUS-PAI-P-211438

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