Hybrid resin-sealed semiconductor device

Details Hybrid resin-sealed semiconductor device Hybrid resin-sealed semiconductor device

1989-12-29

1991-01-08

Hille, Rolf

357 75, 357 70, H01L 2336, H01L 2340, H01L 2348

Patent

active

049840657

ABSTRACT:
A hybrid semiconductor device comprises a heat sink on which a plurality of semiconductor chips are mounted, an insulating substrate secured to the heat sink, conductive metallic layers formed on the insulating substrate, electrodes formed on the semiconductor chips, first thin metallic wires for connecting the electrodes and the conductive metallic layers together, conductive intermediate members integrally formed with the heat sink and located higher than the heat sink, second thin metallic wires for connecting the conductive intermediate members to points to which the first thin metallic wires are connected, and a molding member for sealing and securing the above-mentioned elements. With the above structure, jumpers are arranged in such a manner as not to short-circuit to the conductive metallic layers and other conductive members. Moreover, the hybrid semiconductor device can be manufactured at a low cost since its manufacturing process can reduce the number of steps.

REFERENCES:
patent: 3784884 (1974-01-01), Zoroglu
patent: 4200880 (1980-04-01), Frey
patent: 4739389 (1988-04-01), Goedbloed

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