Patent
1988-08-22
1990-07-17
Davie, James W.
357 74, H01L 2302
Patent
active
049424564
ABSTRACT:
A plastic packaged device comprises a chip element mounted on a supporting member, and covered by a hollow portion. The supporting member has a wall portion at least partially surrounding the chip element. As the hollow portion ends at the wall portion, sufficient space for covering the chip element is achieved.
REFERENCES:
patent: 4054901 (1977-10-01), Edwards et al.
patent: 4697203 (1987-09-01), Sakai et al.
patent: 4717948 (1988-01-01), Sakai et al.
Davie James W.
Kabushiki Kaisha Toshiba
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