Plastic molded type semiconductor device

Details Plastic molded type semiconductor device Plastic molded type semiconductor device

1990-07-12

1991-09-17

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 75, 174 524, 361420, 361421, H01L 2328, H01L 2316, H01L 2952, H01L 2944

Patent

active

050499777

ABSTRACT:
A plurality of leads and two islands are arranged on a lead frame made of a conductive metal. Semiconductor chips, substrates of which have different thicknesses, are mounted on the two islands, and the lead frame is bent and formed such that the chip mounting surfaces of both the islands are lower than the upper surfaces of the corresponding leads by different amounts.

REFERENCES:
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 4800419 (1989-01-01), Long et al.
patent: 4855807 (1989-08-01), Yamaji et al.

Affiliated with

Also associated with

Rating

Plastic molded type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic molded type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic molded type semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1920912