4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With structure for mounting semiconductor chip to lead frame

Shiann-Ming Liou

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active

Die-to-die wire-bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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IC having heat spreader attached by glob-topping

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Integrated circuit devices with ESD and I/O protection

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Method and structure for forming vertical semiconductor intercon

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent

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Method of fabricating a device with ESD and I/O protection

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-994426

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