Die-to-die wire-bonding

Details Die-to-die wire-bonding Die-to-die wire-bonding

2011-06-28

2011-06-28

Arroyo, Teresa M (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S673000, C257S737000, C257S738000, C257S780000

Reexamination Certificate

active

07969022

ABSTRACT:
Methods for die-to-die wire-bonding, and devices and systems formed thereby, are described herein. A die to die wire-bonding method may comprise bonding a first conductive bump having a first bump size to a first die pad; bonding a first wire to a second die pad, the first wire bonded to the second die pad by a second conductive bump having a second bump size, the second bump size being smaller than the first bump size; and bonding the first wire to the first conductive bump.

REFERENCES:
patent: 5828128 (1998-10-01), Higashiguchi et al.
patent: 6905954 (2005-06-01), Hedler et al.
patent: 6972496 (2005-12-01), Choi
patent: 7064425 (2006-06-01), Takahashi et al.
patent: 2003/0062631 (2003-04-01), Nemoto
patent: 2008/0290508 (2008-11-01), Sukegawa et al.
patent: 2009/0014858 (2009-01-01), Boon et al.
patent: 2009/0321951 (2009-12-01), Takiar et al.

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