4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Seung-Kwan Ryu

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Method of forming semiconductor chips, the semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Method of forming semiconductor chips, the semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Semiconductor chip structure, method of manufacturing the...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Groove
Reexamination Certificate

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Wafer level chip scale package having a gap and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Wafer level chip scale package having a gap and method for...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3062578

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