Method of forming semiconductor chips, the semiconductor...

Details Method of forming semiconductor chips, the semiconductor... Method of forming semiconductor chips, the semiconductor...

2007-07-09

2009-06-09

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S612000, C438S613000, C257S678000, C257S737000, C257SE21499, C257SE21502, C257SE21503, C257SE21508, C257SE21511

Reexamination Certificate

active

07544538

ABSTRACT:
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.

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English language abstract of Japanese Publication No. 2005-26582.
English language abstract of Korean Publication No. 10-2005-0021078.
English language abstract of Korean Publication No. 10-2006-0010099.

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