4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With dam or vent for encapsulant

Seon Goo Lee

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Circuit board for semiconductor package

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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High power LED housing and fabrication method thereof

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate

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High power LED package and fabrication method thereof

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate

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High power LED package and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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High power light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1395829

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