Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2007-04-24
2007-04-24
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S098000, C257S100000, C257S692000, C257S693000, C257S696000, C257S706000, C257SE33056, C257SE33057, C257SE33058, C257SE33059
Reexamination Certificate
active
11186971
ABSTRACT:
The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.
REFERENCES:
patent: 6995510 (2006-02-01), Murakami et al.
patent: 2005/0012187 (2005-01-01), Kameyama et al.
Han Kyung Taeg
Kim Chang Wook
Lee Seon Goo
Lowe Hauptman & Berner LLP.
Nguyen Joseph
Parker Kenneth
Samsung Electro-Mechanics Co. Ltd.
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