High power LED housing and fabrication method thereof

Details High power LED housing and fabrication method thereof High power LED housing and fabrication method thereof

2008-10-28

2010-12-07

Chu, Chris (Department: 2815)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C257SE33057, C257S098000, C257S100000, C257S433000, C438S026000, C438S048000, C438S064000

Reexamination Certificate

active

07846752

ABSTRACT:
An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

REFERENCES:
patent: 6274924 (2001-08-01), Carey et al.
patent: 6541800 (2003-04-01), Barnett et al.
patent: 6924514 (2005-08-01), Suenaga
patent: 7045905 (2006-05-01), Nakashima
patent: 7119422 (2006-10-01), Chin
patent: 7253447 (2007-08-01), Oishi et al.
patent: 7321161 (2008-01-01), Teixeira et al.
patent: 7361940 (2008-04-01), Kim et al.
patent: D569353 (2008-05-01), Tokuda et al.
patent: 7462870 (2008-12-01), Nakashima
patent: 7635915 (2009-12-01), Xie et al.
patent: 7719024 (2010-05-01), Bando
patent: 7737463 (2010-06-01), Lee et al.
patent: 2003/0168720 (2003-09-01), Kamada
patent: 2004/0075100 (2004-04-01), Bogner et al.
patent: 2004/0256706 (2004-12-01), Nakashima
patent: 2005/0135105 (2005-06-01), Teixrira et al.
patent: 2005/0194607 (2005-09-01), Barnett et al.
patent: 2005/0269587 (2005-12-01), Loh et al.
patent: 2006/0027829 (2006-02-01), Wang et al.
patent: 2006/0054914 (2006-03-01), Hsian Yi
patent: 2006/0081866 (2006-04-01), Takahashi et al.
patent: 2006/0103012 (2006-05-01), Chin
patent: 2006/0157726 (2006-07-01), Loh et al.
patent: 2006/0175716 (2006-08-01), Nakashima
patent: 2006/0180824 (2006-08-01), Kim et al.
patent: 2006/0267036 (2006-11-01), Lee et al.
patent: 2006/0273338 (2006-12-01), Lee et al.
patent: 58-173248 (1983-11-01), None
patent: 01-293551 (1989-11-01), None
patent: 2002532880 (2002-10-01), None
patent: 2003303936 (2003-10-01), None
patent: 2003332634 (2003-11-01), None
patent: 2004-128241 (2004-04-01), None
patent: 2004343059 (2004-12-01), None
patent: 2005183993 (2005-07-01), None
patent: 2000-0035156 (2000-06-01), None

Affiliated with

Also associated with

Rating

High power LED housing and fabrication method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High power LED housing and fabrication method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High power LED housing and fabrication method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4163265