4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Senol Pekin

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Flip-chip ball grid array package for electromigration testing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Method of rapid wafer bumping

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Multi-level redistribution layer traces for reducing current...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Non-isothermal electromigration testing of microelectronic...

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate

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Optimized bond out method for flip chip wafers

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
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Profile ID: LFUS-PAI-P-2532507

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