Optimized bond out method for flip chip wafers

Details Optimized bond out method for flip chip wafers Optimized bond out method for flip chip wafers

2006-06-20

2006-06-20

Garbowski, Leigh M. (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000

Reexamination Certificate

active

07065721

ABSTRACT:
A method of optimizing a bond out design includes steps of: (a) receiving as input an initial bond out design including at least one selected I/O pad and a top redistribution layer; (b) determining whether to include a lower redistribution layer in an optimized bond out design; (c) selecting a trace design to be included in the optimized bond out design for connecting the selected I/O pad to the top redistribution layer according to a bump function of the selected I/O pad; and (d) generating as output the optimized bond out design.

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