4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Seng Sooi Lim

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Mechanically interlocking ball grid array packages and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Overmold integrated circuit package

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Process for using a removeable plating bus layer for high densit

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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System and method for packaging an integrated circuit using enca

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Profile ID: LFUS-PAI-P-1475360

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