4. Equipment for production, distribution, or transformation of ene
  5. Distribution, modification or control
  6. Semiconductor, transistor or integrated circuit

Se-Yong Oh

Inventor

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Details

Inventor

active

Lead on chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Memory card having a control chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Method of fabricating ultra thin flip-chip package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Semiconductor module

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit
Patent

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Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-682817

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