Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2005-09-13
2005-09-13
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S685000, C257S686000, C257S723000, C257S777000, C257S787000, C257S788000, C257S790000, C257S724000, C257S727000, C257S783000
Reexamination Certificate
active
06943438
ABSTRACT:
In one embodiment, a memory card comprises a card substrate, at least one memory chip attached to the card substrate, a control chip mounted on the memory chip, bonding wires electrically connecting the chips with the card substrate, a passive device attached to the card substrate near the memory chip, and a molded body encapsulating the memory chip, the control chip, the bonding wires and the passive device. In addition, the memory card comprises an adhesive spacer interposed between the same-sized chips to secure a wire loop of the bonding wires.
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Chung Tae-Gyeong
Oh Se-Yong
Son Min-Young
Marger Johnson & McCollom, P .C.
Williams Alexander Oscar
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