Semiconductor package

Details Semiconductor package Semiconductor package

2005-10-04

2005-10-04

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S704000

Reexamination Certificate

active

06952050

ABSTRACT:
Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

REFERENCES:
patent: 5291064 (1994-03-01), Kurokawa
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5621615 (1997-04-01), Dawson et al.
patent: 6091603 (2000-07-01), Daves et al.
patent: 6255140 (2001-07-01), Wang
patent: 2002/0074649 (2002-06-01), Chrysler et al.
patent: 03-173152 (1991-07-01), None
patent: WO01/31082 (2001-05-01), None
English language of Abstract from Japanese patent publication No. 03-173152 published on Jul. 26, 1991.

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