Method of fabricating ultra thin flip-chip package

Details Method of fabricating ultra thin flip-chip package Method of fabricating ultra thin flip-chip package

2007-05-08

2007-05-08

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S614000, C257SE21509

Reexamination Certificate

active

10973528

ABSTRACT:
Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the solder bumps including a bar portion and a ball portion disposed at an end of the bar portion. The semiconductor chip including the three-dimensional structured solder bumps is bonded to a solder layer on a printed circuit board to complete a flip-chip package. According to the present invention, by employing the three-dimensional structured solder bumps, it is possible to lower the height of the solder bumps, thereby improving the reliability of an ultra thin flip-chip package.

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English language abstract of Korean Publication No. P2002-79136.
English language abstract of Korean Publication No. 1996-039234.

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