Method of fabricating ultra thin flip-chip package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S614000, C257SE21509

Reexamination Certificate

active

10973528

ABSTRACT:
Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the solder bumps including a bar portion and a ball portion disposed at an end of the bar portion. The semiconductor chip including the three-dimensional structured solder bumps is bonded to a solder layer on a printed circuit board to complete a flip-chip package. According to the present invention, by employing the three-dimensional structured solder bumps, it is possible to lower the height of the solder bumps, thereby improving the reliability of an ultra thin flip-chip package.

REFERENCES:
patent: 5118299 (1992-06-01), Burns et al.
patent: 5172473 (1992-12-01), Burns et al.
patent: 5185073 (1993-02-01), Bindra et al.
patent: 5435057 (1995-07-01), Bindra et al.
patent: 5541135 (1996-07-01), Pfeifer et al.
patent: 5939786 (1999-08-01), Downes et al.
patent: 6043150 (2000-03-01), Downes et al.
patent: 6291879 (2001-09-01), Yamano
patent: 6384343 (2002-05-01), Furusawa
patent: 6841872 (2005-01-01), Ha et al.
patent: 6959856 (2005-11-01), Oh et al.
patent: 2002/0121692 (2002-09-01), Lee et al.
patent: 2005/0208751 (2005-09-01), Oh et al.
patent: 1996-039234 (1996-11-01), None
patent: P2002-79136 (2002-10-01), None
English language abstract of Korean Publication No. P2002-79136.
English language abstract of Korean Publication No. 1996-039234.

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