Lead on chip semiconductor package

Details Lead on chip semiconductor package Lead on chip semiconductor package

2005-03-11

2008-08-19

Tran, Long K (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257SE23039, C438S111000, C438S112000, C438S123000

Reexamination Certificate

active

07414303

ABSTRACT:
The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.

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