4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Ryuji Nomoto

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Device having resin package and method of producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Device having resin package and method of producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Device having resin package with projections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent

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Method for producing a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent

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Method of designing circuit board

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Profile ID: LFUS-PAI-P-308362

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