Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent
1997-05-27
1999-07-27
Graybill, David
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
438616, 22818022, H01L 21288, H01L 2156, H01L 2160
Patent
active
059306033
ABSTRACT:
A method for producing a semiconductor device includes steps of: a) a positioning board forming process in which concave portions, each of which is located at a position corresponding to a position of a respective projecting electrode of a semiconductor device, and first positioning portions, which are used for determining a position of a sealing resin with respect to the projecting electrode, are integrally formed on a flat-plate member so as to form a positioning board; b) a filling process in which an electrode material for forming the projecting electrode is filled in the concave portions formed on the positioning board; c) a bonding process in which a composite board is formed by mounting a circuit board on the positioning board so as to bond each of the electrode material filled in the concave portions to the circuit board; d) a sealing resin forming process in which a mold having a cavity for forming a sealing resin and second positioning portions for determining a position of the positioning board with respect to the cavity is fixed to the composite board in a state that the position of the positioning board is determined with respect to the cavity by engaging the first positioning portions with the respective second positioning portions, and resin is filled in the cavity so as to form the sealing resin, and e) a positioning board removing process in which the positioning board is removed.
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Nomoto Ryuji
Onodera Masanori
Orimo Seiichi
Sakoda Hideharu
Tsuji Kazuto
Fujitsu Limited
Graybill David
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