4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Roy D. Hollaway

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Angulated semiconductor packages

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Ceramic semiconductor package and method for fabricating the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Chip-size semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package having adhesive bead supporting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-206620

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