4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Ronald Patrick Huemoeller

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Buildup dielectric and metallization process and...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Bumped chip package fabrication method and structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Circuit-on-foil process for manufacturing a laminated...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
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Electronic component package comprising fan-out traces

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Embedded die metal etch stop fabrication method and structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-2159577

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