Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-04-26
2011-04-26
Malsawma, Lex (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23067
Reexamination Certificate
active
07932595
ABSTRACT:
A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
REFERENCES:
patent: 2596993 (1952-05-01), Gookin
patent: 3435815 (1969-04-01), Forcier
patent: 3734660 (1973-05-01), Davies et al.
patent: 3781596 (1973-12-01), Galli et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 4054238 (1977-10-01), Lloyd et al.
patent: 4189342 (1980-02-01), Kock
patent: 4258381 (1981-03-01), Inaba
patent: 4289922 (1981-09-01), Devlin
patent: 4301464 (1981-11-01), Otsuki et al.
patent: 4332537 (1982-06-01), Slepcevic
patent: 4417266 (1983-11-01), Grabbe
patent: 4451224 (1984-05-01), Harding
patent: 4530152 (1985-07-01), Roche et al.
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 4646710 (1987-03-01), Schmid et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4727633 (1988-03-01), Herrick
patent: 4729061 (1988-03-01), Brown
patent: 4737839 (1988-04-01), Burt
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4812896 (1989-03-01), Rothgery et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4907067 (1990-03-01), Derryberry
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 4942454 (1990-07-01), Mori et al.
patent: 4987475 (1991-01-01), Schlesinger et al.
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5029386 (1991-07-01), Chao et al.
patent: 5041902 (1991-08-01), McShane
patent: 5057900 (1991-10-01), Yamazaki
patent: 5059379 (1991-10-01), Tsutsumi et al.
patent: 5065223 (1991-11-01), Matsuki et al.
patent: 5070039 (1991-12-01), Johnson et al.
patent: 5087961 (1992-02-01), Long et al.
patent: 5091341 (1992-02-01), Asada et al.
patent: 5096852 (1992-03-01), Hobson
patent: 5118298 (1992-06-01), Murphy
patent: 5122860 (1992-06-01), Kikuchi et al.
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5151039 (1992-09-01), Murphy
patent: 5157475 (1992-10-01), Yamaguchi
patent: 5157480 (1992-10-01), McShane et al.
patent: 5168368 (1992-12-01), Gow, III et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5172214 (1992-12-01), Casto
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5214845 (1993-06-01), King et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5218231 (1993-06-01), Kudo
patent: 5221642 (1993-06-01), Burns
patent: 5250841 (1993-10-01), Sloan et al.
patent: 5250843 (1993-10-01), Eichelberger
patent: 5252853 (1993-10-01), Michii
patent: 5258094 (1993-11-01), Furui et al.
patent: 5266834 (1993-11-01), Nishi et al.
patent: 5268310 (1993-12-01), Goodrich et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5277972 (1994-01-01), Sakumoto et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5279029 (1994-01-01), Burns
patent: 5281849 (1994-01-01), Singh Deo et al.
patent: 5294897 (1994-03-01), Notani et al.
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5332864 (1994-07-01), Liang et al.
patent: 5335771 (1994-08-01), Murphy
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5343076 (1994-08-01), Katayama et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5358905 (1994-10-01), Chiu
patent: 5365106 (1994-11-01), Watanabe
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5391439 (1995-02-01), Tomita et al.
patent: 5394303 (1995-02-01), Yamaji
patent: 5406124 (1995-04-01), Morita et al.
patent: 5410180 (1995-04-01), Fuji et al.
patent: 5414299 (1995-05-01), Wang et al.
patent: 5417905 (1995-05-01), Lemaire et al.
patent: 5424576 (1995-06-01), Djennas et al.
patent: 5428248 (1995-06-01), Cha
patent: 5432677 (1995-07-01), Mowatt et al.
patent: 5435057 (1995-07-01), Bindra et al.
patent: 5444301 (1995-08-01), Song et al.
patent: 5452511 (1995-09-01), Chang
patent: 5454904 (1995-10-01), Ghezzo et al.
patent: 5454905 (1995-10-01), Fogelson
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5484274 (1996-01-01), Neu
patent: 5493151 (1996-02-01), Asada et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5508556 (1996-04-01), Lin
patent: 5517056 (1996-05-01), Bigler et al.
patent: 5521429 (1996-05-01), Aono et al.
patent: 5528076 (1996-06-01), Pavio
patent: 5534467 (1996-07-01), Rostoker
patent: 5539251 (1996-07-01), Iverson et al.
patent: 5543657 (1996-08-01), Diffenderfer et al.
patent: 5544412 (1996-08-01), Romero et al.
patent: 5545923 (1996-08-01), Barber
patent: 5576517 (1996-11-01), Wojnarowski et al.
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5581122 (1996-12-01), Chao et al.
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5592025 (1997-01-01), Clark et al.
patent: 5594274 (1997-01-01), Suetaki
patent: 5595934 (1997-01-01), Kim
patent: 5604376 (1997-02-01), Hamburgen et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5608267 (1997-03-01), Mahulikar et al.
patent: 5619068 (1997-04-01), Benzoni
patent: 5625222 (1997-04-01), Yoneda et al.
patent: 5633528 (1997-05-01), Abbott et al.
patent: 5639990 (1997-06-01), Nishihara et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5641997 (1997-06-01), Ohta et al.
patent: 5643433 (1997-07-01), Fukase et al.
patent: 5644169 (1997-07-01), Chun
patent: 5646831 (1997-07-01), Manteghi
patent: 5650663 (1997-07-01), Parthasarathi
patent: 5661088 (1997-08-01), Tessier et al.
patent: 5665996 (1997-09-01), Williams et al.
patent: 5673479 (1997-10-01), Hawthorne
patent: 5683806 (1997-11-01), Sakumoto et al.
patent: 5689135 (1997-11-01), Ball
patent: 5696666 (1997-12-01), Miles et al.
patent: 5701034 (1997-12-01), Marrs
patent: 5703407 (1997-12-01), Hori
patent: 5710064 (1998-01-01), Song et al.
patent: 5723899 (1998-03-01), Shin
patent: 5724233 (1998-03-01), Honda et al.
patent: 5726493 (1998-03-01), Yamashita et al.
patent: 5736432 (1998-04-01), Mackessy
patent: 5736448 (1998-04-01), Saia et al.
patent: 5745984 (1998-05-01), Cole, Jr. et al.
patent: 5753532 (1998-05-01), Sim
patent: 5753977 (1998-05-01), Kusaka et al.
patent: 5766972 (1998-06-01), Takahashi et al.
patent: 5769989 (1998-06-01), Hoffmeyer et al.
patent: 5770888 (1998-06-01), Song et al.
patent: 5776798 (1998-07-01), Quan et al.
patent: 5783861 (1998-07-01), Son
patent: 5786238 (1998-07-01), Pai et al.
patent: 5801440 (1998-09-01), Chu et al.
patent: 5814877 (1998-09-01), Diffenderfer et al.
patent: 5814881 (1998-09-01), Alagaratnam et al.
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5814884 (1998-09-01), Davis et al.
patent: 5817540 (1998-10-01), Wark
patent: 5818105 (1998-10-01), Kouda
patent: 5821457 (1998-10-01), Mosley et al.
patent: 5821615 (1998-10-01), Lee
patent: 5834830 (1998-11-01), Cho
patent: 5835988 (1998-11-01), Ishii
patent: 5841193 (1998-11-01), Eichelberger
patent: 5844306 (1998-12-01), Fujita et al.
patent: 5856911 (1999-01-01), Riley
patent: 5859471 (1999-01-01), Kuraishi et al.
patent: 5859475 (1999-01-01), Freyman et al.
patent: 5866939 (1999-02-01), Shin et al.
patent: 5871782 (1999-02-01), Choi
patent: 5874770 (1999-02-01), Saia et al.
patent: 5874784 (1999-02-01), Aoki et al.
patent: 5877043 (1999-03-01), Alcoe et al.
patent: 5886397 (1999-03-01), Ewer
patent: 5886398 (1999-03-01), Low et al.
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5897339 (1999-04-01), Song et al.
patent: 5900676 (1999-05-01), Kweon et al.
patent: 5903049 (1999-05-01), Mori
patent: 5903050 (1999-05-01), Thurairajaratnam et al.
patent: 5909053 (1999-06-01), Fukase et al.
patent: 5915998 (1999-06-01), Stidham et al.
patent: 5917242 (1999-06-01), Ball
patent: 5937324 (1999-08-01), Abercrombie et al.
patent: 5939779 (1999-08-01), Kim
patent: 5942794 (1999-08-01), Okumura et al.
patent
Huemoeller Ronald Patrick
Razu David
Rusli Sukianto
Amkor Technology Inc.
Gunnison McKay & Hodgson, L.L.P.
Hodgson Serge J.
Malsawma Lex
LandOfFree
Electronic component package comprising fan-out traces does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic component package comprising fan-out traces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component package comprising fan-out traces will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2734350