Embedded die metal etch stop fabrication method and structure

Details Embedded die metal etch stop fabrication method and structure Embedded die metal etch stop fabrication method and structure

2011-05-31

2011-05-31

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S584000

Reexamination Certificate

active

07951697

ABSTRACT:
A method of forming an electronic component package includes forming a patterned dielectric layer comprising circuit pattern artifacts and at least one electronic component opening. An etch stop metal protected circuit pattern is plated with the circuit pattern artifacts. An electronic component is mounted in the electronic component opening. The etch stop metal protected circuit pattern provide an etch stop for substrate formation etch processes. In this manner, etching of a patterned conductor layer is avoided insuring that impedance is controlled to within tight tolerance.

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