4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Ronald L. Schlupp

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Merged platinum silicide fuse and Schottky diode and method of m

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Method and system for providing a power lateral PNP...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Lateral bipolar transistor structure
Reexamination Certificate

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Method and system for providing a power lateral PNP...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Having heterojunction
Reexamination Certificate

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Multi-layer film stack polish stop

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Process for formation of trench in integrated circuit structure

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Profile ID: LFUS-PAI-P-1050626

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