Robert W. Bower

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Aligned wafer bonding

Metal fusion bonding – Process – Diffusion type
Patent

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Asymmetrical well charge coupled device

Electrical transmission or interconnection systems – Nonlinear reactor systems – Parametrons
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Digital pressure switch and method of fabrication

Electricity: circuit makers and breakers – Fluid pressure – Diaphragm
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Integrated circuit structure with active device in merged slot a

Fishing – trapping – and vermin destroying
Patent

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Integrated circuit structure with active elements of bipolar tra

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Profile ID: LFUS-PAI-P-672789

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