Aligned wafer bonding

Details Aligned wafer bonding Aligned wafer bonding

1992-05-12

1993-08-17

Heinrich, Samuel M.

Metal fusion bonding

Process

Diffusion type

228105, 228231, 437 15, 437 51, 437225, H01L 2102, H01L 21324

Patent

active

052361187

ABSTRACT:
A process for precision alignment and bonding of complementary micromechanical, electrical and optical structures. Surface features of the structures are critically aligned and brought into physical contact within atomic dimensions to form direct bonds without the use of adhesives. The bonds are initially formed at room temperature and then strengthened by a high temperature anneal. Three dimensional structures may be formed in separate prefabricated layers rather than monolithically through the use of this process.

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Advertisements and product brochures by Karl Suss America, Inc.
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