4. Electricity: conductors and insulators
  5. Feedthrough or bushing
  6. Compression

Rikio Sugiura

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High packing density lead frame and integrated circuit

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Package for integrated circuit

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Resin-molded semiconductor device

Electricity: conductors and insulators – Feedthrough or bushing – Compression
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Semiconductor device

Patent

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Semiconductor device and a method for fabricating the same

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Profile ID: LFUS-PAI-P-340260

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