Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1986-08-07
1988-02-09
Grimley, Arthur T.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 74, H01L 2328
Patent
active
047242809
ABSTRACT:
PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main body of PLCC to fill the gap, i.e. a channel, between the protuberances. The height of the filling, namely the height of the interconnector, is lower than that of prior art protuberance to leave some space. This space, a channel, serves as a duct for solvent to flow therein smoothly to and from the narrow gap between the soldered lead and the top of the protuberance and is located adjoining this narrow gap. Therefore, the undesirably remaining flux in this narrow gap is perfectly removed by this smooth flow of the solvent. The leg portion of the protuberance is strengthened by the interconnector so that the occurrence of a crack of the protuberance when the moled PLCC is ejected from the molding cavities is considerably reduced. The structure, using the interconnector, can also avoid using a slanted protuberance having a sharp top which is likely to hurt the fingers of a PLCC handler, or which has too narrow a bottom as a channel for solvent to smoothly flow.
REFERENCES:
patent: 4089575 (1978-05-01), Grabbe
patent: 4465898 (1984-08-01), Orcutt et al.
patent: 4495376 (1985-01-01), Hightower et al.
Aoki Tsuyoshi
Ono Michio
Sugiura Rikio
Tsuji Kazuto
Fujitsu Limited
Grimley Arthur T.
Tone David A.
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