1983-12-23
1986-03-11
Sikes, William L.
357 70, H01L 2302, H01L 2312
Patent
active
045757488
ABSTRACT:
A semiconductor device having a base which receives therein a semiconductor chip and a plurality of lead terminals having inner ends which are connected to the semiconductor chip by connecting wires. The lead terminals are, at their outer ends, spaced from one another at a constant pitch, and are bent toward the respective outermost lead terminals between the inner ends and the outer ends and outside the base.
REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 4066839 (1978-01-01), Cossutta et al.
Sugawara Takehisa
Sugiura Rikio
Terui Kazuo
Fujitsu Limited
Sikes William L.
Wise Robert E.
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