Resin-molded semiconductor device

Details Resin-molded semiconductor device Resin-molded semiconductor device

1986-02-12

1987-10-06

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 74, 174 52FP, H01L 2350, H01L 2300

Patent

active

046986600

ABSTRACT:
A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.

REFERENCES:
patent: 3940786 (1976-02-01), Scheingold et al.
patent: 4142287 (1979-03-01), Grabbe
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4224637 (1980-09-01), Hargis
patent: 4463217 (1984-07-01), Orcutt
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-3, No. 4, Dec. 1980, "Development of a 68-Pin Multiple In-Line Package", William L. Brodsky et al.

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