High packing density lead frame and integrated circuit

Details High packing density lead frame and integrated circuit High packing density lead frame and integrated circuit

1988-04-19

1989-01-31

Carroll, J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 174 524, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

048019976

ABSTRACT:
Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip stage and the edge of a molded case is made as thin as possible and held by inner lead supporting bars to tie bars until the molding process is finished. After molding process is finished, these bars supporting the leads and stage are cut away. Packing density is improved an amount ranging from 20% to 30%.

REFERENCES:
patent: 4066839 (1978-01-01), Cossata et al.
patent: 4138691 (1979-02-01), Bonkohara et al.
patent: 4331740 (1982-05-01), Burns
patent: 4441118 (1984-04-01), Fister et al.

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